Plasma dicing is becoming increasingly attractive in the semiconductor market. Dies are becoming smaller and thinner and manufacturers are facing difficulties such as increasing material loss due to the width of the dicing line, mechanical damage to the dies from chipping and increasingly longer processing times due to line-by-line mechanical dicing.

Panasonic’s APX300-DM Plasma Dicer solves these challenges and simultaneously provides a higher quality product with a lower cost of production. Ideal for thin, brittle, and ultra-thin wafers; a damage-free, particle-free, stress-free and high die strength non-contact dicing and enabling ultra-narrow 20μm dicing street. Up to 300mm wafer and patented tape and frame protection from effects of plasma during dicing.