PSX307/PSX307A Plasma Cleaner
NM-EFP1A/NM-EFP3A
Product details
The PSX307 Plasma Cleaner’s parallel plate chamber technology delivers superior etch uniformity over conventional batch systems. Experience surface cleaning before wirebond or flip-chip attach and surface activation and improved underfill wettability and mold encapsulation.
The PSX307A variant supports both wafer-level processes and traditional substrate device-level processes. Surface modification of wafer before Insulation Layer, after Redistribution Layer, ball attach or after dicing to improve the die attach process.
Key features
- Parallel plate technology enabling uniformity
- Substrate or 300mm Wafer, with or without dicing frame
- Patented Plasma Monitor (real-time)
- Unit level process traceability
- Argon, Oxygen or mixed process gas options