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MD-P300 Flip Chip Bonder

NM-EFF1C

Product details

Panasonic's  process-flexible, MD-P300 flip chip bonder combines flip chip, thermosonic, and thermocompression bonding in a single, small footprint solution.

Flexible bonding tools change from thermosonic to C4 to TCB processes directly. It also supports 300mm (12") wafer substrates. The MD-P300 is an ideal solution for COB hybrid assembly with an in-line Panasonic SMT placement machine.

Fast cycle times and placement accuracy of +/-5μm at 0.5 seconds per IC (dry run)—with thermosonic and C4 processes at 0.65 seconds, including process times.

Key features

  • Real-time inspection allows you to realize higher manufacturing accuracy
  • Process versatility
  • Ideal for processors and CMOS and MEMS power devices
  • Bonding processes are available by switching the bonding tools, which can be done under the configuration of C4 dipping unit
  • Bonding stage camera enables post-bonding inspection right after the die bonding. (OP)

Specification Description
Model ID MD-P300
Model No. NM-EFF1C
Productivity * C4 : 0.65s/IC (including dipping motion)
Thermosonic : 0.65s/IC (including US process time of 0.2s)
[*1]
Placement Accuracy * XY (3 at PFSC conditions) : ±5 µm
[*1]
Substrate Dimensions (mm) L 50 × W 50 to L 330 × W 330 (Heating specifications : L 330 × W 220 mm)
Die Dimensions (mm) L 1 × W 1 to L 25 × W 25 ( Thermosonic : L7 × W 7)
Number of Die Types Up to 12 product types (AWC specifications) 
*1 nozzle type
Die Supply Wafer frame 12 inches (Option : 8 inches)
Bonding Load VCM head : 1N to 50 N (Option : 2 N to 100 N)
Head Heating Thermosonic : Up to 300℃
Substrate Heating * Constant heating, Up to 200℃ (Heating bonding stage specifications : Max. substrate size L 330 × W 220 mm)
[*2]
Power Source * 3-phase AC 200V ± 10V, 50/60 Hz,
Up to 4 kVA (Up to 7 kVA for heating specification)
[*3]
Pneumatic Source 0.4 Mpa, 50L/min(A.N.R.)
(Up to 150 L/min for full-featured machine including cooling air)
Dimensions (mm) W 1,380 × D 1,640 × H 1,430 ( without loader / unloader)
Mass 2,300 kg ( without loader / unloader)
[*1]: The described productivity and placement accuracy may differ depending on the conditions of use
[*2]: Maximum setting temperature differ depending on the maximum substrate size. Please contact us individually
[*3]: 3-phase 208 / 220 / 380 / 400 / 415 / 480