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MD-P200US2 Ultrasonic Bonder

NM-EFF1D

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Panasonic Microelectronics MD-P200US2

Product details

Panasonic's MD-P200 is a high-productivity die bonder. The synchronous head system offers unparalleled productivity, providing results that surpass conventional die bonders. The wafer supply, pre-centering, bond head and dispenser work in parallel to achieve high-throughput.

The MD-P200 solves today's need for small and thin die bonding and offers capabilities for tomorrow's challenges as well. Accurate die pre-centering ensures minimal die tilt and a novel ejector design handles thin dies. Functionality for multi-die packages is also available.

Key features

  • Wafer mapping software capability
  • Low bond force option
  • Epoxy writing or pin transfer
  • High accuracy
  • Flexible for multiple die
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Panasonic Microelectronics MD-P200US2

Model ID MD-P200US2
Model No. NM-EFF1D
Productivity * 0.65 s / IC for thermosonic bonding
(Including process time of 0.2 seconds. Under the fastest conditions)
[*1]
Placement Accuracy * XY (3 at Panasonic conditions) : ±7 µm
[*1]
Substrate Dimensions (mm) L 50 × W 30 to L 120 × W 120
Die Dimensions (mm) L 0.25 × W 0.25 to L 6 × W 6
Number of Die Types 1 product type (manual wafer supply) / Up to 12 product types (AWC specifications)
*Nozzle is one type
Die Supply Wafer frame (Max. 8 inch) , Tray
Bonding Load VCM head for thermosonic process : 1 N to 50 N (Option : 2 N to 100 N)
Head Heating Up to 300℃ for the VCM head
Substrate Heating Constant heating, Up to 300℃
Power Source * 3-phase AC 200 V ±10V, 50 / 60 Hz,
Up to 1.7 kVA (Up to 7.5 kVA for heating specification)
[*2]
Pneumatic Source 0.4 to 0.5 Mpa (Max. 0.8 Mpa), 30 L / min (A.N.R.)
(Up to 150 L / min for full-featured machine including cooling air)
Dimensions (mm) W 1,340 × D 1,140 × H 1,400 (Including loader/unloader)
Mass 1,750 kg (Including loader / unloader)
[*1]: The described productivity and placement accuracy may differ depending on the conditions of use
[*2]: Three phase 208 / 220 / 380 / 400 / 415 / 480
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